Global Semiconductor Packaging and Assembly Equipments Market Size, Status and Forecast 2020-2026

Published On: April 2020 | Report ID: 20496 | Category: Machinery & EquipmentPages: 114

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.

The die-level packaging and assembly equipment segment to be the major revenue contributing segment in this market during the forecasted period.

The APAC region to continue dominating this market during the forecast period. This region currently accounts for more than 65% of the total revenue share. The presence of leading semiconductor foundries in this region, such as Taiwan Semiconductor Manufacturing, United Microelectronics, Samsung, and Semiconductor Manufacturing International, is expected to impel market growth during the forecast period.

The Semiconductor Packaging and Assembly Equipments market was valued at xx Million US$ In 2020 and is projected to reach xx Million US$ by 2026, at a CAGR of xx% during the forecast period. In this study, 2019 has been considered as the base year and 2020 to 2026 as the forecast period to estimate the market size for Semiconductor Packaging and Assembly Equipments.

This report presents the worldwide Semiconductor Packaging and Assembly Equipments market size (value, production and consumption), splits the breakdown (data status 2015-2020 and forecast to 2026), by manufacturers, region, type and application.

This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

The following manufacturers are covered in this report:

Applied Materials

ASMPT

DISCO Corporation

EV Group

Kulicke and Soffa Industries

TEL

Tokyo Seimitsu

Rudolph Technologies

SEMES

Suss Microtec

Ultratech

Ulvac Technologies

Semiconductor Packaging and Assembly Equipments Breakdown Data by Type

Die- Level Packaging and Assembly Equipment

Wafer-Level Packaging and Assembly Equipment

Semiconductor Packaging and Assembly Equipments Breakdown Data by Application

IDM (Integrated Device Manufacturers)

OSAT (Outsourced Semiconductor Assembly and Test Companies)

Semiconductor Packaging and Assembly Equipments Production by Region

United States

Europe

China

Japan

Other Regions

Semiconductor Packaging and Assembly Equipments Consumption by Region

North America

United States

Canada

Mexico

Asia-Pacific

China

India

Japan

South Korea

Australia

Indonesia

Malaysia

Philippines

Thailand

Vietnam

Europe

Germany

France

UK

Italy

Russia

Rest of Europe

Central & South America

Brazil

Rest of South America

Middle East & Africa

GCC Countries

Turkey

Egypt

South Africa

Rest of Middle East & Africa

The study objectives are:

To analyze and research the global Semiconductor Packaging and Assembly Equipments status and future forecast´╝îinvolving, production, revenue, consumption, historical and forecast.

To present the key Semiconductor Packaging and Assembly Equipments manufacturers, production, revenue, market share, and recent development.

To split the breakdown data by regions, type, manufacturers and applications.

To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.

To identify significant trends, drivers, influence factors in global and regions.

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of Semiconductor Packaging and Assembly Equipments :

History Year: 2015 - 2019

Base Year: 2019

Estimated Year: 2020

Forecast Year: 2020 - 2026

This report includes the estimation of market size for value (million USD) and volume (K Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Semiconductor Packaging and Assembly Equipments market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

For the data information by region, company, type and application, 2019 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Table of Contents

1 Study Coverage

1.1 Semiconductor Packaging and Assembly Equipments Product

1.2 Key Market Segments in This Study

1.3 Key Manufacturers Covered

1.4 Market by Type

1.4.1 Global Semiconductor Packaging and Assembly Equipments Market Size Growth Rate by Type

1.4.2 Die- Level Packaging and Assembly Equipment

1.4.3 Wafer-Level Packaging and Assembly Equipment

1.5 Market by Application

1.5.1 Global Semiconductor Packaging and Assembly Equipments Market Size Growth Rate by Application

1.5.2 IDM (Integrated Device Manufacturers)

1.5.3 OSAT (Outsourced Semiconductor Assembly and Test Companies)

1.6 Study Objectives

1.7 Years Considered

2 Executive Summary

2.1 Global Semiconductor Packaging and Assembly Equipments Market Size

2.1.1 Global Semiconductor Packaging and Assembly Equipments Revenue 2015-2026

2.1.2 Global Semiconductor Packaging and Assembly Equipments Production 2015-2026

2.2 Semiconductor Packaging and Assembly Equipments Growth Rate (CAGR) 2020-2026

2.3 Analysis of Competitive Landscape

2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)

2.3.2 Key Semiconductor Packaging and Assembly Equipments Manufacturers

2.3.2.1 Semiconductor Packaging and Assembly Equipments Manufacturing Base Distribution, Headquarters

2.3.2.2 Manufacturers Semiconductor Packaging and Assembly Equipments Product Offered

2.3.2.3 Date of Manufacturers Enter into Semiconductor Packaging and Assembly Equipments Market

2.4 Key Trends for Semiconductor Packaging and Assembly Equipments Markets & Products

3 Market Size by Manufacturers

3.1 Semiconductor Packaging and Assembly Equipments Production by Manufacturers

3.1.1 Semiconductor Packaging and Assembly Equipments Production by Manufacturers

3.1.2 Semiconductor Packaging and Assembly Equipments Production Market Share by Manufacturers

3.2 Semiconductor Packaging and Assembly Equipments Revenue by Manufacturers

3.2.1 Semiconductor Packaging and Assembly Equipments Revenue by Manufacturers (2015-2020)

3.2.2 Semiconductor Packaging and Assembly Equipments Revenue Share by Manufacturers (2015-2020)

3.3 Semiconductor Packaging and Assembly Equipments Price by Manufacturers

3.4 Mergers & Acquisitions, Expansion Plans

4 Semiconductor Packaging and Assembly Equipments Production by Regions

4.1 Global Semiconductor Packaging and Assembly Equipments Production by Regions

4.1.1 Global Semiconductor Packaging and Assembly Equipments Production Market Share by Regions

4.1.2 Global Semiconductor Packaging and Assembly Equipments Revenue Market Share by Regions

4.2 United States

4.2.1 United States Semiconductor Packaging and Assembly Equipments Production

4.2.2 United States Semiconductor Packaging and Assembly Equipments Revenue

4.2.3 Key Players in United States

4.2.4 United States Semiconductor Packaging and Assembly Equipments Import & Export

4.3 Europe

4.3.1 Europe Semiconductor Packaging and Assembly Equipments Production

4.3.2 Europe Semiconductor Packaging and Assembly Equipments Revenue

4.3.3 Key Players in Europe

4.3.4 Europe Semiconductor Packaging and Assembly Equipments Import & Export

4.4 China

4.4.1 China Semiconductor Packaging and Assembly Equipments Production

4.4.2 China Semiconductor Packaging and Assembly Equipments Revenue

4.4.3 Key Players in China

4.4.4 China Semiconductor Packaging and Assembly Equipments Import & Export

4.5 Japan

4.5.1 Japan Semiconductor Packaging and Assembly Equipments Production

4.5.2 Japan Semiconductor Packaging and Assembly Equipments Revenue

4.5.3 Key Players in Japan

4.5.4 Japan Semiconductor Packaging and Assembly Equipments Import & Export

4.6 Other Regions

4.6.1 South Korea

4.6.2 India

4.6.3 Southeast Asia

5 Semiconductor Packaging and Assembly Equipments Consumption by Regions

5.1 Global Semiconductor Packaging and Assembly Equipments Consumption by Regions

5.1.1 Global Semiconductor Packaging and Assembly Equipments Consumption by Regions

5.1.2 Global Semiconductor Packaging and Assembly Equipments Consumption Market Share by Regions

5.2 North America

5.2.1 North America Semiconductor Packaging and Assembly Equipments Consumption by Application

5.2.2 North America Semiconductor Packaging and Assembly Equipments Consumption by Countries

5.2.3 United States

5.2.4 Canada

5.2.5 Mexico

5.3 Europe

5.3.1 Europe Semiconductor Packaging and Assembly Equipments Consumption by Application

5.3.2 Europe Semiconductor Packaging and Assembly Equipments Consumption by Countries

5.3.3 Germany

5.3.4 France

5.3.5 UK

5.3.6 Italy

5.3.7 Russia

5.4 Asia Pacific

5.4.1 Asia Pacific Semiconductor Packaging and Assembly Equipments Consumption by Application

5.4.2 Asia Pacific Semiconductor Packaging and Assembly Equipments Consumption by Countries

5.4.3 China

5.4.4 Japan

5.4.5 South Korea

5.4.6 India

5.4.7 Australia

5.4.8 Indonesia

5.4.9 Thailand

5.4.10 Malaysia

5.4.11 Philippines

5.4.12 Vietnam

5.5 Central & South America

5.5.1 Central & South America Semiconductor Packaging and Assembly Equipments Consumption by Application

5.5.2 Central & South America Semiconductor Packaging and Assembly Equipments Consumption by Country

5.5.3 Brazil

5.6 Middle East and Africa

5.6.1 Middle East and Africa Semiconductor Packaging and Assembly Equipments Consumption by Application

5.6.2 Middle East and Africa Semiconductor Packaging and Assembly Equipments Consumption by Countries

5.6.3 GCC Countries

5.6.4 Egypt

5.6.5 South Africa

6 Market Size by Type

6.1 Global Semiconductor Packaging and Assembly Equipments Production by Type

6.2 Global Semiconductor Packaging and Assembly Equipments Revenue by Type

6.3 Semiconductor Packaging and Assembly Equipments Price by Type

7 Market Size by Application

7.1 Overview

7.2 Global Semiconductor Packaging and Assembly Equipments Breakdown Dada by Application

7.2.1 Global Semiconductor Packaging and Assembly Equipments Consumption by Application

7.2.2 Global Semiconductor Packaging and Assembly Equipments Consumption Market Share by Application (2015-2020)

8 Manufacturers Profiles

8.1 Applied Materials

8.1.1 Applied Materials Company Details

8.1.2 Company Overview

8.1.3 Applied Materials Semiconductor Packaging and Assembly Equipments Production Revenue and Gross Margin (2015-2020)

8.1.4 Applied Materials Semiconductor Packaging and Assembly Equipments Product Description

8.1.5 Applied Materials Recent Development

8.2 ASMPT

8.2.1 ASMPT Company Details

8.2.2 Company Overview

8.2.3 ASMPT Semiconductor Packaging and Assembly Equipments Production Revenue and Gross Margin (2015-2020)

8.2.4 ASMPT Semiconductor Packaging and Assembly Equipments Product Description

8.2.5 ASMPT Recent Development

8.3 DISCO Corporation

8.3.1 DISCO Corporation Company Details

8.3.2 Company Overview

8.3.3 DISCO Corporation Semiconductor Packaging and Assembly Equipments Production Revenue and Gross Margin (2015-2020)

8.3.4 DISCO Corporation Semiconductor Packaging and Assembly Equipments Product Description

8.3.5 DISCO Corporation Recent Development

8.4 EV Group

8.4.1 EV Group Company Details

8.4.2 Company Overview

8.4.3 EV Group Semiconductor Packaging and Assembly Equipments Production Revenue and Gross Margin (2015-2020)

8.4.4 EV Group Semiconductor Packaging and Assembly Equipments Product Description

8.4.5 EV Group Recent Development

8.5 Kulicke and Soffa Industries

8.5.1 Kulicke and Soffa Industries Company Details

8.5.2 Company Overview

8.5.3 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipments Production Revenue and Gross Margin (2015-2020)

8.5.4 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipments Product Description

8.5.5 Kulicke and Soffa Industries Recent Development

8.6 TEL

8.6.1 TEL Company Details

8.6.2 Company Overview

8.6.3 TEL Semiconductor Packaging and Assembly Equipments Production Revenue and Gross Margin (2015-2020)

8.6.4 TEL Semiconductor Packaging and Assembly Equipments Product Description

8.6.5 TEL Recent Development

8.7 Tokyo Seimitsu

8.7.1 Tokyo Seimitsu Company Details

8.7.2 Company Overview

8.7.3 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipments Production Revenue and Gross Margin (2015-2020)

8.7.4 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipments Product Description

8.7.5 Tokyo Seimitsu Recent Development

8.8 Rudolph Technologies

8.8.1 Rudolph Technologies Company Details

8.8.2 Company Overview

8.8.3 Rudolph Technologies Semiconductor Packaging and Assembly Equipments Production Revenue and Gross Margin (2015-2020)

8.8.4 Rudolph Technologies Semiconductor Packaging and Assembly Equipments Product Description

8.8.5 Rudolph Technologies Recent Development

8.9 SEMES

8.9.1 SEMES Company Details

8.9.2 Company Overview

8.9.3 SEMES Semiconductor Packaging and Assembly Equipments Production Revenue and Gross Margin (2015-2020)

8.9.4 SEMES Semiconductor Packaging and Assembly Equipments Product Description

8.9.5 SEMES Recent Development

8.10 Suss Microtec

8.10.1 Suss Microtec Company Details

8.10.2 Company Overview

8.10.3 Suss Microtec Semiconductor Packaging and Assembly Equipments Production Revenue and Gross Margin (2015-2020)

8.10.4 Suss Microtec Semiconductor Packaging and Assembly Equipments Product Description

8.10.5 Suss Microtec Recent Development

8.11 Ultratech

8.12 Ulvac Technologies

9 Production Forecasts

9.1 Semiconductor Packaging and Assembly Equipments Production and Revenue Forecast

9.1.1 Global Semiconductor Packaging and Assembly Equipments Production Forecast 2020-2026

9.1.2 Global Semiconductor Packaging and Assembly Equipments Revenue Forecast 2020-2026

9.2 Semiconductor Packaging and Assembly Equipments Production and Revenue Forecast by Regions

9.2.1 Global Semiconductor Packaging and Assembly Equipments Revenue Forecast by Regions

9.2.2 Global Semiconductor Packaging and Assembly Equipments Production Forecast by Regions

9.3 Semiconductor Packaging and Assembly Equipments Key Producers Forecast

9.3.1 United States

9.3.2 Europe

9.3.3 China

9.3.4 Japan

9.4 Forecast by Type

9.4.1 Global Semiconductor Packaging and Assembly Equipments Production Forecast by Type

9.4.2 Global Semiconductor Packaging and Assembly Equipments Revenue Forecast by Type

10 Consumption Forecast

10.1 Semiconductor Packaging and Assembly Equipments Consumption Forecast by Application

10.2 Semiconductor Packaging and Assembly Equipments Consumption Forecast by Regions

10.3 North America Market Consumption Forecast

10.3.1 North America Semiconductor Packaging and Assembly Equipments Consumption Forecast by Regions 2020-2026

10.3.2 United States

10.3.3 Canada

10.3.4 Mexico

10.4 Europe Market Consumption Forecast

10.4.1 Europe Semiconductor Packaging and Assembly Equipments Consumption Forecast by Regions 2020-2026

10.4.2 Germany

10.4.3 France

10.4.4 UK

10.4.5 Italy

10.4.6 Russia

10.5 Asia Pacific Market Consumption Forecast

10.5.1 Asia Pacific Semiconductor Packaging and Assembly Equipments Consumption Forecast by Regions 2020-2026

10.5.2 China

10.5.3 Japan

10.5.4 South Korea

10.5.5 India

10.5.6 Australia

10.5.7 Indonesia

10.5.8 Thailand

10.5.9 Malaysia

10.5.10 Philippines

10.5.11 Vietnam

10.6 Central & South America Market Consumption Forecast

10.6.1 Central & South America Semiconductor Packaging and Assembly Equipments Consumption Forecast by Regions 2020-2026

10.6.2 Brazil

10.7 Middle East and Africa Market Consumption Forecast

10.7.1 Middle East and Africa Semiconductor Packaging and Assembly Equipments Consumption Forecast by Regions 2020-2026

10.7.2 GCC Countries

10.7.3 Egypt

10.7.4 South Africa

11 Value Chain and Sales Channels Analysis

11.1 Value Chain Analysis

11.2 Sales Channels Analysis

11.2.1 Semiconductor Packaging and Assembly Equipments Sales Channels

11.2.2 Semiconductor Packaging and Assembly Equipments Distributors

11.3 Semiconductor Packaging and Assembly Equipments Customers

12 Market Opportunities & Challenges, Risks and Influences Factors Analysis

12.1 Market Opportunities and Drivers

12.2 Market Challenges

12.3 Market Risks/Restraints

13 Key Findings in the Global Semiconductor Packaging and Assembly Equipments Study

14 Appendix

14.1 Research Methodology

14.1.1 Methodology/Research Approach

14.1.1.1 Research Programs/Design

14.1.1.2 Market Size Estimation

14.1.1.3 Market Breakdown and Data Triangulation

14.1.2 Data Source

14.1.2.1 Secondary Sources

14.1.2.2 Primary Sources

14.2 Author Details

14.3 Disclaimer

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