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Global 8K TV Panels Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Publish Date: July 2019 | Price: $3480

8K resolution refers to any screen or display with around 8000 pixels width. 8K is the current highest ultra high definition television (UHDTV) resolution in digital television. 8K in 8K UHD refers to the horizontal resolution of 7,680 pixels, forming the total image dimensions of (7680×4320), a...

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Global Far-field Speech Recognition Market 2019 by Company, Regions, Type and Application, Forecast to 2024

Publish Date: July 2019 | Price: $3480

Far-field speech recognition is an essential technology for speech interactions, and aims to enable smart devices to recognize distant human speech (usually 1m-10m). This technology is applied to many scenarios such as smart home appliances (smart loudspeaker, smart TV), meeting transcription, an...

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Global Metal Oxide Varistor Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Publish Date: July 2019 | Price: $3480

A Metal Oxide Varistor (MOV) is a protection component used in power supply circuits that is powered directly from AC mains. The Metal Oxide Varistor or MOV is a voltage dependent, nonlinear device that provides excellent transient voltage suppression. The Metal Oxide Varistor is designed to prot...

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Global Ball Bonder Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Publish Date: July 2019 | Price: $3480

Ball Bonder is one sort of semiconductior manufacturing machine, ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a chip and the outside world as part of semiconductor device fabrication.

Scope of the Rep...

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Global Semiconductor Bonder Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Publish Date: July 2019 | Price: $3480

Semiconductor Bonder is a sort of semiconductor equipment which include wire bonder and ball bonder.

Scope of the Report:

The worldwide market for Semiconductor Bonder is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx mill...

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Global Die Bonding Machine Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Publish Date: July 2019 | Price: $3480

Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass

Scope of the Report:

The worldwide market for Di...

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Global RF Coaxial Switches Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Publish Date: July 2019 | Price: $3480

In a telecommunications network, a switch is a device that channels incoming data from any of multiple input ports to the specific output port that will take the data toward its intended destination.

Scope of the Report:

The worldwide market for RF Coaxial ...

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Global RRAM Market 2019 by Company, Regions, Type and Application, Forecast to 2024

Publish Date: July 2019 | Price: $3480

RRAM is a type of non-volatile (NV) random-access (RAM) computer memory that works by changing the resistance across a dielectric solid-state material often referred to as a memristor. This technology bears some similarities to conductive-bridging RAM (CBRAM), and phase-change memory (PCM).

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Global Industrial Machine Vision Cameras Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Publish Date: July 2019 | Price: $3480

Industrial machine vision cameras depend on digital sensors with specialized optics to capture images, in order to process, analyze, and measure various characteristics by using computer hardware and software for accurate decision making. A machine vision camera can easily inspect minute object d...

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Global Multilayer PCB Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Publish Date: July 2019 | Price: $3480

Multilayer PCB is made up of three or more conductive layers (copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.

Sc...

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